DTIP of MEMS & MOEMS (design, test, integration and packaging of MEMS-MOEMS 2007)Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, isbn 978-2-35500-006-5, 1Vol, XIV-392 p, isbn 978-2-35500-006-5Conference Proceedings

Characterization and Modeling of an Electro-thermal MEMS StructureSZABO, P. G; SZEKELY, V.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 350-354, isbn 978-2-35500-006-5, 1Vol, 5 p.Conference Paper

Electrostatically Driven Microgripper Integrated Piezoresistive Force SensorTAO CHEN; LIGUO CHEN; LINING SUN et al.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 376-380, isbn 978-2-35500-006-5, 1Vol, 5 p.Conference Paper

Haptic Sensing for MEMS with Application for Cantilever and Casimir EffectCALIS, M; DESMULLIEZ, M. P. Y.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 80-83, isbn 978-2-35500-006-5, 1Vol, 4 p.Conference Paper

High Q-factor CMOS-MEMS inductorDAI, Ching-Liang; HONG, Jin-Yu; LIU, Mao-Chen et al.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 138-141, isbn 978-2-35500-006-5, 1Vol, 4 p.Conference Paper

Microfluidic Device for Continuous Magnetophoretic Separation of Red Blood CellsILIESCU, Ciprian; BARBARINI, Elena; AVRAM, Marioara et al.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 279-281, isbn 978-2-35500-006-5, 1Vol, 3 p.Conference Paper

Portable Valve-less Peristaltic Micropump Design and FabricationYANG, H; TSAI, T.-H; HU, C.-C et al.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 273-278, isbn 978-2-35500-006-5, 1Vol, 6 p.Conference Paper

RF-MEMS Switched Varactors for Medium Power ApplicationsMAURY, F; POTHIER, A; CRUNTEANU, A et al.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 251-253, isbn 978-2-35500-006-5, 1Vol, 3 p.Conference Paper

Sub-μ structured Lotus Surfaces ManufacturingWORGULL, M; HECKELE, M; MAPPES, T et al.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 330-334, isbn 978-2-35500-006-5, 1Vol, 5 p.Conference Paper

Copper Electrodeposition for 3D IntegrationBEICA, Rozalia; SHARBONO, Charles; RITZDORF, Tom et al.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 127-131, isbn 978-2-35500-006-5, 1Vol, 5 p.Conference Paper

Design Optimization for an Electro-Thermally Actuated Polymeric MicrogripperVOICU, R; MULLER, R; EFTIME, L et al.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 182-186, isbn 978-2-35500-006-5, 1Vol, 5 p.Conference Paper

Design and Fabrication of a Novel Micro Electromagnetic ActuatorLEE, Chia-Yen; CHEN, Zgen-Hui; CHANG, Hsien-Tseng et al.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 52-55, isbn 978-2-35500-006-5, 1Vol, 4 p.Conference Paper

Hybridization of Magnetism and Piezoelectricity for an Energy Scavenger based on Temporal Variation of TemperatureCARLIOZ, Louis; DELAMARE, Jérome; BASROUR, Skandar et al.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 311-313, isbn 978-2-35500-006-5, 1Vol, 3 p.Conference Paper

Micro Embossing of Ceramic Green Substrates for Micro DevicesXUECHUAN SHAN; LING, S. H; MAW, H. P et al.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 355-359, isbn 978-2-35500-006-5, 1Vol, 5 p.Conference Paper

Micro-electroforming Metallic Bipolar Electrodes for Mini-DMFC StacksSHYU, R. F; YANG, H; LEE, J.-H et al.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 192-196, isbn 978-2-35500-006-5, 1Vol, 5 p.Conference Paper

Modelling MEMS structures using Cosserat theoryCALIS, M; LAGROUCHE, O; DESMULLIEZ, M. P. Y et al.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 77-79, isbn 978-2-35500-006-5, 1Vol, 3 p.Conference Paper

On-Chip Hotplate for Temperature Control of CMOS SAW ResonatorsNORDIN, A. N; VOICULESCU, I; ZAGHLOUL, M et al.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 71-76, isbn 978-2-35500-006-5, 1Vol, 6 p.Conference Paper

Processing and Characterization of Precision Microparts from Nickel-based MaterialsALLEN, D. M; ALMOND, H. J; BEDNER, K et al.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 335-338, isbn 978-2-35500-006-5, 1Vol, 4 p.Conference Paper

Design and Analysis of a Chaotic Micromixer with Vortices ModulationTUNG, K. Y; YANG, J. T.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 282-284, isbn 978-2-35500-006-5, 1Vol, 3 p.Conference Paper

Design and Fabrication of Acoustic Wave Actuated Microgenerator for Portable Electronic DevicesLAI, Tenghsien; CHANGHAN HUANG; TSOU, Chingfu et al.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 28-33, isbn 978-2-35500-006-5, 1Vol, 6 p.Conference Paper

Fabrication of Embedded Microvalve on PMMA Microfluidic Devices through Surface FunctionalizationTOH, A. G. G; WANG, Z. F; NG, S. H et al.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 267-272, isbn 978-2-35500-006-5, 1Vol, 6 p.Conference Paper

Fabrication ofNanostmctured PLGA Scaffolds Using Anodic Aluminum Oxide TemplatesHSUEH, Cheng-Chih; WANG, Gou-Jen; HSU, Shan-Hui et al.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 292-295, isbn 978-2-35500-006-5, 1Vol, 4 p.Conference Paper

Flexible Micro Thermoelectric Generator based on Electroplated Bi_2+xTe_3-xSCHWYTER, Etienne; GLATZ, Wulf; DURRER, Lukas et al.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 46-48, isbn 978-2-35500-006-5, 1Vol, 3 p.Conference Paper

Geometrical Variation Analysis of an Electrothermally Driven Polysilicon MicoactuatorSHAMSHIRSAZ, M; MAROUFI, M; ASGARI, M. B et al.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 259-261, isbn 978-2-35500-006-5, 1Vol, 3 p.Conference Paper

High Aspect Pattern Formation by Integration of Micro Inkjetting and Electroless PlatingGIAN, P. W; XUECHUAN SHAN; LIANG, Y. N et al.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 162-167, isbn 978-2-35500-006-5, 1Vol, 6 p.Conference Paper